Bonded structure and bonding-condition detecting method
US-10145786-B2 · Dec 4, 2018 · US
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Patent family 51898105
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 51898105 |
| Family type | — |
| Earliest priority | May 14, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10145786B2 — Bonded structure and bonding-condition detecting method |
Representative publication
Best representative member for this family based on priority and filing country.
US10145786B2 — Bonded structure and bonding-condition detecting method (published Dec 4, 2018)
Member publications
Related publications in this family.
Bonded structure and bonding-condition detecting method
US-2016069793-A1 · Mar 10, 2016 · US