Friction modulation for three dimensional relief in a haptic device
US-11054907-B2 · Jul 6, 2021 · US
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 50002558 |
| Family type | — |
| Earliest priority | Jan 24, 2013 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US11054907B2 — Friction modulation for three dimensional relief in a haptic device |
Best representative member for this family based on priority and filing country.
US11054907B2 — Friction modulation for three dimensional relief in a haptic device (published Jul 6, 2021)
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