Wafer level packaging of microbolometer vacuum package assemblies
US-10553454-B2 · Feb 4, 2020 · US
This page is not indexed by search engines while we improve data quality.
Patent family 49998705
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 49998705 |
| Family type | — |
| Earliest priority | Dec 31, 2012 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US10553454B2 — Wafer level packaging of microbolometer vacuum package assemblies |
Representative publication
Best representative member for this family based on priority and filing country.
US10553454B2 — Wafer level packaging of microbolometer vacuum package assemblies (published Feb 4, 2020)
Member publications
Related publications in this family.
Wafer level packaging of microbolometer vacuum package assemblies
US-2017372920-A1 · Dec 28, 2017 · US
Wafer level packaging of microbolometer vacuum package assemblies
US-9741591-B2 · Aug 22, 2017 · US