Copper electroplating method
US-9963797-B2 · May 8, 2018 · US
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Patent family 49385180
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 49385180 |
| Family type | — |
| Earliest priority | Oct 22, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9963797B2 — Copper electroplating method |
Representative publication
Best representative member for this family based on priority and filing country.
US9963797B2 — Copper electroplating method (published May 8, 2018)
Member publications
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Copper electroplating method
US-2016258077-A1 · Sep 8, 2016 · US