Dental root canal filling material having improved thermal conductive characteristics
US-10357434-B2 · Jul 23, 2019 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 48747708 |
| Family type | — |
| Earliest priority | May 21, 2012 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US10357434B2 — Dental root canal filling material having improved thermal conductive characteristics |
Best representative member for this family based on priority and filing country.
US10357434B2 — Dental root canal filling material having improved thermal conductive characteristics (published Jul 23, 2019)
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