Method for depositing a first metallic layer onto non-conductive polymers
US-9551073-B2 · Jan 24, 2017 · US
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Patent family 47740839
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 47740839 |
| Family type | — |
| Earliest priority | Feb 13, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9551073B2 — Method for depositing a first metallic layer onto non-conductive polymers |
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US9551073B2 — Method for depositing a first metallic layer onto non-conductive polymers (published Jan 24, 2017)
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