Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates
US-9293448-B2 · Mar 22, 2016 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 47677603 |
| Family type | — |
| Earliest priority | Aug 9, 2011 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US9293448B2 — Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates |
Best representative member for this family based on priority and filing country.
US9293448B2 — Methods of forming three-dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates (published Mar 22, 2016)
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