Slotted configuration for optimized placement of micro-components using adhesive bonding
US-10175448-B2 · Jan 8, 2019 · US
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Patent family 44068222
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 44068222 |
| Family type | — |
| Earliest priority | Dec 1, 2009 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US10175448B2 — Slotted configuration for optimized placement of micro-components using adhesive bonding |
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US10175448B2 — Slotted configuration for optimized placement of micro-components using adhesive bonding (published Jan 8, 2019)
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