Biocompatible bonding method and electronics package suitable for implantation
US-9849297-B2 · Dec 26, 2017 · US
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Patent family 37590650
This patent family groups 4 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 37590650 |
| Family type | — |
| Earliest priority | Apr 11, 2002 |
| First filing country | US |
| Member publications | 4 |
| Countries | US |
| Representative publication | US9849297B2 — Biocompatible bonding method and electronics package suitable for implantation |
Representative publication
Best representative member for this family based on priority and filing country.
US9849297B2 — Biocompatible bonding method and electronics package suitable for implantation (published Dec 26, 2017)
Member publications
Related publications in this family.
Biocompatible Bonding Method and Electronics Package Suitable for Implantation
US-2017095671-A1 · Apr 6, 2017 · US
Biocompatible bonding method and electronics package suitable for implantation
US-9532451-B2 · Dec 27, 2016 · US
Biocompatible Bonding Method and Electronics Package Suitable for Implantation
US-2016255720-A1 · Sep 1, 2016 · US