Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-10217629-B2 · Feb 26, 2019 · US
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Patent family 37192518
This patent family groups 5 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 37192518 |
| Family type | — |
| Earliest priority | Jun 2, 2006 |
| First filing country | US |
| Member publications | 5 |
| Countries | US |
| Representative publication | US10217629B2 — Method of forming dielectric films, new precursors and their use in semiconductor manufacturing |
Representative publication
Best representative member for this family based on priority and filing country.
US10217629B2 — Method of forming dielectric films, new precursors and their use in semiconductor manufacturing (published Feb 26, 2019)
Member publications
Related publications in this family.
Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-2018151354-A1 · May 31, 2018 · US
Methods of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-9911590-B2 · Mar 6, 2018 · US
Methods of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-2017125242-A1 · May 4, 2017 · US
Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-9583335-B2 · Feb 28, 2017 · US