Interposer for semiconductor package including integrated photonic components and methods of fabrication thereof
US-2025385231-A1 · Dec 18, 2025 · US
the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips
the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10D80/30 |
| Official title | the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips |
| Display label | the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips |
| Total patents | 294 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2020 | 3 |
| 2021 | 5 |
| 2022 | 5 |
| 2023 | 10 |
| 2024 | 8 |
| 2025 | 123 |
| 2026 | 140 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding method
US-2025385190-A1 · Dec 18, 2025 · US
Integrated inductors using multiple dies
US-2025379195-A1 · Dec 11, 2025 · US
Preserving access to optical components on a wafer package with sacrificial die
US-2025372586-A1 · Dec 4, 2025 · US
Packaging optical components in a circuit package
US-2025370202-A1 · Dec 4, 2025 · US
Three-dimensional semiconductor package component and method for making the same
US-2025364487-A1 · Nov 27, 2025 · US
Semiconductor package and method of fabricating the same
US-2025364476-A1 · Nov 27, 2025 · US
Semiconductor package
US-2025357445-A1 · Nov 20, 2025 · US
Package-on-package with different types of memory
US-2025349813-A1 · Nov 13, 2025 · US
Semiconductor chip including through electrode, and semiconductor package including the same
US-12463114-B2 · Nov 4, 2025 · US
Semiconductor package having auxiliary substrate
US-2025336836-A1 · Oct 30, 2025 · US
Semiconductor package
US-2025323135-A1 · Oct 16, 2025 · US
Semiconductor Devices and Methods of Making Semiconductor Devices Having Embedded Photonic Bridge Die
US-2025316659-A1 · Oct 9, 2025 · US
Electronic device and method of manufacturing the same
US-2025316568-A1 · Oct 9, 2025 · US
Power supply circuit, signal transmission device, electronic device and vehicle
US-2025309885-A1 · Oct 2, 2025 · US
Microelectronic devices, and related memory devices and electronic systems
US-2025301635-A1 · Sep 25, 2025 · US
Imaging device
US-12426435-B2 · Sep 23, 2025 · US
Cascaded radio frequency system in a single multi-chip package
US-2025293184-A1 · Sep 18, 2025 · US
Package structure including inactive element, assembly structure and method of manufacturing the same
US-2025285956-A1 · Sep 11, 2025 · US
Electronic component package
US-12400922-B2 · Aug 26, 2025 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10D80/30?
- CPC H10D80/30 is the Cooperative Patent Classification code for “the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips.”
- How many patents are filed under CPC H10D80/30 (the at least one device being covered by groups H10D84/00 - H10D86/00, e.g. assemblies comprising integrated circuit processor chips)?
- Our database includes 294 publications tagged with this CPC code.
- Is patent activity under CPC H10D80/30 growing?
- Publication counts under this code: 8 in 2024 vs 123 in 2025 (latest complete years).