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Mounting by adhesive material

Mounting by adhesive material · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH02G3/266
Official title{Mounting by adhesive material}
Display labelMounting by adhesive material
Total patents21

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
20152
20165
20171
20181
20192
20205
20223
20231
20241

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.