with resin casing

with resin casing · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH02B13/01
Official titlewith resin casing
Display labelwith resin casing
Total patents33

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is growing.

Patents filed per year
YearPatents
20154
20162
20173
20186
20192
20203
20212
20223
20232
20246

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H02B13/01?
CPC H02B13/01 is the Cooperative Patent Classification code for “with resin casing.”
How many patents are filed under CPC H02B13/01 (with resin casing)?
Our database includes 33 publications tagged with this CPC code.
Is patent activity under CPC H02B13/01 growing?
Publication counts under this code: 2 in 2023 vs 6 in 2024 (latest complete years).