Making a non-soldered electrical connection simultaneously with the heat shrinking

Making a non-soldered electrical connection simultaneously with the heat shrinking · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01R4/726
Official title{Making a non-soldered electrical connection simultaneously with the heat shrinking}
Display labelMaking a non-soldered electrical connection simultaneously with the heat shrinking
Total patents29

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is rapidly declining.

Patents filed per year
YearPatents
20152
20164
20171
20184
20192
20205
20214
20221
20232
20243
20251

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01R4/726?
CPC H01R4/726 is the Cooperative Patent Classification code for “Making a non-soldered electrical connection simultaneously with the heat shrinking.”
How many patents are filed under CPC H01R4/726 (Making a non-soldered electrical connection simultaneously with the heat shrinking)?
Our database includes 29 publications tagged with this CPC code.
Is patent activity under CPC H01R4/726 growing?
Publication counts under this code: 3 in 2024 vs 1 in 2025 (latest complete years).