Making a soldered electrical connection simultaneously with the heat shrinking

Making a soldered electrical connection simultaneously with the heat shrinking · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01R4/723
Official title{Making a soldered electrical connection simultaneously with the heat shrinking}
Display labelMaking a soldered electrical connection simultaneously with the heat shrinking
Total patents28

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
20153
20161
20172
20184
20191
20206
20214
20223
20231
20241
20252

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01R4/723?
CPC H01R4/723 is the Cooperative Patent Classification code for “Making a soldered electrical connection simultaneously with the heat shrinking.”
How many patents are filed under CPC H01R4/723 (Making a soldered electrical connection simultaneously with the heat shrinking)?
Our database includes 28 publications tagged with this CPC code.
Is patent activity under CPC H01R4/723 growing?
Publication counts under this code: 1 in 2024 vs 2 in 2025 (latest complete years).