assembled by {a separate} clip or spring

assembled by {a separate} clip or spring · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01R13/508
Official titleassembled by {a separate} clip or spring
Display labelassembled by {a separate} clip or spring
Total patents340

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is stable.

Patents filed per year
YearPatents
201515
201612
201726
201831
201926
202030
202142
202233
202328
202449
202540
20268

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01R13/508?
CPC H01R13/508 is the Cooperative Patent Classification code for “assembled by {a separate} clip or spring.”
How many patents are filed under CPC H01R13/508 (assembled by {a separate} clip or spring)?
Our database includes 340 publications tagged with this CPC code.
Is patent activity under CPC H01R13/508 growing?
Publication counts under this code: 49 in 2024 vs 40 in 2025 (latest complete years).