comprising a layer of expanded material

comprising a layer of expanded material · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01Q1/424
Official title{comprising a layer of expanded material}
Display labelcomprising a layer of expanded material
Total patents40

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is growing.

Patents filed per year
YearPatents
20153
20173
20183
20203
20213
20223
202310
20246
20255
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01Q1/424?
CPC H01Q1/424 is the Cooperative Patent Classification code for “comprising a layer of expanded material.”
How many patents are filed under CPC H01Q1/424 (comprising a layer of expanded material)?
Our database includes 40 publications tagged with this CPC code.
Is patent activity under CPC H01Q1/424 growing?
Publication counts under this code: 6 in 2024 vs 5 in 2025 (latest complete years).