Solid structures for heat exchange or heat conduction

Solid structures for heat exchange or heat conduction · Cooperative Patent Classification (CPC)

Electric circuits, power, telecommunications, and semiconductors.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeH01M10/655
Official titleSolid structures for heat exchange or heat conduction
Display labelSolid structures for heat exchange or heat conduction
Total patents1,119

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is growing.

Patents filed per year
YearPatents
201532
201646
201751
201852
201982
202092
2021102
2022139
2023155
2024152
2025171
202645

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC H01M10/655?
CPC H01M10/655 is the Cooperative Patent Classification code for “Solid structures for heat exchange or heat conduction.”
How many patents are filed under CPC H01M10/655 (Solid structures for heat exchange or heat conduction)?
Our database includes 1,119 publications tagged with this CPC code.
Is patent activity under CPC H01M10/655 growing?
Publication counts under this code: 152 in 2024 vs 171 in 2025 (latest complete years).