Microelectronic assemblies with inductors in direct bonding regions
US-2024355768-A1 · Oct 24, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L28/10 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,968 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 135 |
| 2016 | 187 |
| 2017 | 207 |
| 2018 | 218 |
| 2019 | 215 |
| 2020 | 233 |
| 2021 | 180 |
| 2022 | 185 |
| 2023 | 177 |
| 2024 | 191 |
| 2025 | 40 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Dual sided embedded passives via panel level thermal compression bonding
US-2024113000-A1 · Apr 4, 2024 · US
Semiconductor device and method of manufacturing the same
US-11901288-B2 · Feb 13, 2024 · US
Rolled-up inductor structure for a radiofrequency integrated circuit (RFIC)
US-9224532-B2 · Dec 29, 2015 · US
Coil and Method of Manufacturing a Coil
US-2015372073-A1 · Dec 24, 2015 · US
Integrated inductor
US-9219106-B2 · Dec 22, 2015 · US
Inductor structure with magnetic material
US-9219109-B2 · Dec 22, 2015 · US
Signal monitoring of through-wafer vias using a multi-layer inductor
US-2015362534-A1 · Dec 17, 2015 · US
Inductor formed on a semiconductor substrate
US-2015364532-A1 · Dec 17, 2015 · US
Highly coupled spiral planar inductors structure at bump to compensate on die excess capacitance of differential I/O
US-9214426-B1 · Dec 15, 2015 · US
Toroid inductor in redistribution layers (RDL) of an integrated device
US-9209131-B2 · Dec 8, 2015 · US
Semiconductor device having inductor
US-2015340423-A1 · Nov 26, 2015 · US
Forming magnetic microelectromechanical inductive components
US-9193584-B2 · Nov 24, 2015 · US
Semiconductor substrate and method for manufacturing semiconductor substrate
US-9196669-B2 · Nov 24, 2015 · US
Semiconductor device and adjustment method of filter circuit
US-9190977-B2 · Nov 17, 2015 · US
N-channel double diffusion MOS transistor with P-type buried layer under N-type drift layer, and semiconductor composite device
US-9190513-B2 · Nov 17, 2015 · US
Method for fabricating a coil by way of a rounded trench
US-9183977-B2 · Nov 10, 2015 · US
Wireless interconnects in an interposer
US-9165791-B2 · Oct 20, 2015 · US
Silicon carrier space transformer and temporary chip attach burn-in vehicle for high density connections
US-9159616-B2 · Oct 13, 2015 · US
Silicon process compatible trench magnetic device
US-9159778-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L28/10?
- CPC H01L28/10 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L28/10 (Electricity)?
- Our database includes 1,968 publications tagged with this CPC code.
- Is patent activity under CPC H01L28/10 growing?
- Publication counts under this code: 191 in 2024 vs 40 in 2025 (latest complete years).