Packaged semiconductor device with electroplated pillars
US-2021375808-A1 · Dec 2, 2021 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/11903 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 77 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 15 |
| 2017 | 9 |
| 2018 | 10 |
| 2019 | 4 |
| 2020 | 6 |
| 2021 | 10 |
| 2022 | 3 |
| 2023 | 4 |
| 2024 | 4 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and semiconductor device manufacturing method
US-2021280543-A1 · Sep 9, 2021 · US
Semiconductor structure and method for forming the same
US-11094655-B2 · Aug 17, 2021 · US
Packaged semiconductor device with electroplated pillars
US-11094656-B2 · Aug 17, 2021 · US
Packaging Mechanisms for Dies with Different Sizes of Connectors
US-2021217672-A1 · Jul 15, 2021 · US
Semiconductor device and semiconductor device manufacturing method
US-11049826-B2 · Jun 29, 2021 · US
Semiconductor structure having a conductive bump with a plurality of bump segments
US-11018099-B2 · May 25, 2021 · US
Semiconductor device bonding area including fused solder film and manufacturing method
US-2021118831-A1 · Apr 22, 2021 · US
Packaging mechanisms for dies with different sizes of connectors
US-10964610-B2 · Mar 30, 2021 · US
Semiconductor device bonding area including fused solder film and manufacturing method
US-10910331-B2 · Feb 2, 2021 · US
Semiconductor structure and method for forming the same
US-2020395323-A1 · Dec 17, 2020 · US
Method of manufacturing a semiconductor structure
US-10861711-B1 · Dec 8, 2020 · US
Expanded head pillar for bump bonds
US-2020258856-A1 · Aug 13, 2020 · US
Packaged semiconductor device with electroplated pillars
US-2020211990-A1 · Jul 2, 2020 · US
Expanded head pillar for bump bonds
US-10636758-B2 · Apr 28, 2020 · US
Multiple plated via arrays of different wire heights on same substrate
US-10629567-B2 · Apr 21, 2020 · US
Packaging Mechanisms for Dies with Different Sizes of Connectors
US-2019341319-A1 · Nov 7, 2019 · US
Packaging mechanisms for dies with different sizes of connectors
US-10354931-B2 · Jul 16, 2019 · US
Multiple plated via arrays of different wire heights on same substrate
US-2019148344-A1 · May 16, 2019 · US
Multiple bond via arrays of different wire heights on a same substrate
US-10290613-B2 · May 14, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/11903?
- CPC H01L2224/11903 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/11903 (Electricity)?
- Our database includes 77 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/11903 growing?
- Publication counts under this code: 4 in 2024 vs 5 in 2025 (latest complete years).