Semiconductor device and method of integrating power module with interposer and opposing substrates
US-2024304603-A1 · Sep 12, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/0603 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,293 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 64 |
| 2016 | 93 |
| 2017 | 122 |
| 2018 | 127 |
| 2019 | 156 |
| 2020 | 130 |
| 2021 | 106 |
| 2022 | 80 |
| 2023 | 108 |
| 2024 | 148 |
| 2025 | 135 |
| 2026 | 24 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Sensor packaging method and sensor package
US-2024222308-A1 · Jul 4, 2024 · US
Contact Test Structure and Method
US-2015380329-A1 · Dec 31, 2015 · US
Light-emitting device including light-emitting diode element that is mounted on outer portion of electrode
US-9224720-B2 · Dec 29, 2015 · US
Method and structure for wafer level packaging with large contact area
US-9224669-B2 · Dec 29, 2015 · US
Semiconductor module having deflecting conductive layer over a spacer structure
US-9219034-B2 · Dec 22, 2015 · US
Semiconductor device for battery power voltage control
US-9209113-B2 · Dec 8, 2015 · US
Semiconductor module and method for manufacturing same
US-9202757-B2 · Dec 1, 2015 · US
Semiconductor device that attenuates high-frequency oscillation
US-9190368-B2 · Nov 17, 2015 · US
Compound semiconductor device and method of manufacturing the same
US-9184273-B2 · Nov 10, 2015 · US
Semiconductor device having a breakdown voltage holding region
US-9184286-B2 · Nov 10, 2015 · US
Chip arrangements and methods for manufacturing a chip arrangement
US-9184066-B2 · Nov 10, 2015 · US
Semiconductor chip having different conductive pad widths and method of making layout for same
US-2015318249-A1 · Nov 5, 2015 · US
Semiconductor device and method of manufacturing the same
US-9177833-B2 · Nov 3, 2015 · US
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US-9171761-B2 · Oct 27, 2015 · US
Mounting member having die pad unit and terminals, and photocoupler having the mounting member
US-9171969-B2 · Oct 27, 2015 · US
Semiconductor unit and semiconductor device using the same
US-9165871-B2 · Oct 20, 2015 · US
Semiconductor device
US-9165901-B2 · Oct 20, 2015 · US
Semiconductor device
US-9165845-B2 · Oct 20, 2015 · US
Semiconductor module with a semiconductor chip and a passive component and method for producing the same
US-9159720-B2 · Oct 13, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/0603?
- CPC H01L2224/0603 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/0603 (Electricity)?
- Our database includes 1,293 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/0603 growing?
- Publication counts under this code: 148 in 2024 vs 135 in 2025 (latest complete years).