Chip package structure and method for preparing chip package structure
US-2024178167-A1 · May 30, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/05624 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,627 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 127 |
| 2016 | 183 |
| 2017 | 165 |
| 2018 | 125 |
| 2019 | 145 |
| 2020 | 176 |
| 2021 | 105 |
| 2022 | 70 |
| 2023 | 125 |
| 2024 | 174 |
| 2025 | 195 |
| 2026 | 37 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
US-9219045-B2 · Dec 22, 2015 · US
Stack packages and methods of fabricating the same
US-9214410-B2 · Dec 15, 2015 · US
Method of making a die with recessed aluminum die pads
US-9209078-B2 · Dec 8, 2015 · US
Electronic device packages having bumps and methods of manufacturing the same
US-9209146-B2 · Dec 8, 2015 · US
Semiconductor device for battery power voltage control
US-9209113-B2 · Dec 8, 2015 · US
Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch
US-9202713-B2 · Dec 1, 2015 · US
Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure
US-9202794-B2 · Dec 1, 2015 · US
Chip device packages and fabrication methods thereof
US-9196571-B2 · Nov 24, 2015 · US
Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures
US-9190297-B2 · Nov 17, 2015 · US
Chip package and method for forming the same
US-9184092-B2 · Nov 10, 2015 · US
Semiconductor device and method of manufacturing the same
US-9177833-B2 · Nov 3, 2015 · US
Semiconductor packages and methods of manufacturing the same
US-9171821-B2 · Oct 27, 2015 · US
Resin sealing type semiconductor device and method of manufacturing the same, and lead frame
US-9171761-B2 · Oct 27, 2015 · US
Chip package comprising alignment mark and method for forming the same
US-9165890-B2 · Oct 20, 2015 · US
Integrated circuit, a chip package and a method for manufacturing an integrated circuit
US-9165792-B2 · Oct 20, 2015 · US
Semiconductor device
US-9165901-B2 · Oct 20, 2015 · US
Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
US-9153476-B2 · Oct 6, 2015 · US
Method of wire bonding over active area of a semiconductor circuit
US-9153555-B2 · Oct 6, 2015 · US
Semiconductor device
US-9147645-B2 · Sep 29, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/05624?
- CPC H01L2224/05624 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/05624 (Electricity)?
- Our database includes 1,627 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/05624 growing?
- Publication counts under this code: 174 in 2024 vs 195 in 2025 (latest complete years).