Metal routing architecture for integrated circuits
US-9224688-B2 · Dec 29, 2015 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/05166 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,241 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 70 |
| 2016 | 97 |
| 2017 | 153 |
| 2018 | 113 |
| 2019 | 134 |
| 2020 | 116 |
| 2021 | 109 |
| 2022 | 97 |
| 2023 | 96 |
| 2024 | 115 |
| 2025 | 122 |
| 2026 | 19 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method of manufacturing a semiconductor component
US-9219010-B2 · Dec 22, 2015 · US
Structure design for 3DIC testing
US-9219016-B2 · Dec 22, 2015 · US
Package on package structures and methods for forming the same
US-9219030-B2 · Dec 22, 2015 · US
Method of forming a HEMT semiconductor device and structure therefor
US-9214423-B2 · Dec 15, 2015 · US
Semiconductor package
US-9209148-B2 · Dec 8, 2015 · US
Semiconductor device
US-2015348924-A1 · Dec 3, 2015 · US
Directly sawing wafers covered with liquid molding compound
US-9196559-B2 · Nov 24, 2015 · US
Chip packaging structures and treatment methods thereof
US-2015325544-A1 · Nov 12, 2015 · US
Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
US-2015325546-A1 · Nov 12, 2015 · US
Etchant and method for manufacturing semiconductor device using same
US-9177827-B2 · Nov 3, 2015 · US
Etching agent for copper or copper alloy
US-9175404-B2 · Nov 3, 2015 · US
Embedding thin chips in polymer
US-9171794-B2 · Oct 27, 2015 · US
GaN transistor with improved bonding pad structure and method of fabricating the same
US-9165896-B2 · Oct 20, 2015 · US
Crack stopper on under-bump metallization layer
US-9159686-B2 · Oct 13, 2015 · US
Semiconductor device including a solder and method of fabricating the same
US-9159688-B2 · Oct 13, 2015 · US
Method of wire bonding over active area of a semiconductor circuit
US-9153555-B2 · Oct 6, 2015 · US
Semiconductor devices having stacked solder bumps with intervening metal layers to provide electrical interconnections
US-9142498-B2 · Sep 22, 2015 · US
Method of wire bonding over active area of a semiconductor circuit
US-9142527-B2 · Sep 22, 2015 · US
Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump
US-9142522-B2 · Sep 22, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/05166?
- CPC H01L2224/05166 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/05166 (Electricity)?
- Our database includes 1,241 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/05166 growing?
- Publication counts under this code: 115 in 2024 vs 122 in 2025 (latest complete years).