Semiconductor package including an integrated circuit die and an inductor or a transformer
US-12588222-B2 · Mar 24, 2026 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L2224/02205 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 60 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2017 | 8 |
| 2018 | 10 |
| 2019 | 8 |
| 2020 | 7 |
| 2021 | 9 |
| 2022 | 5 |
| 2023 | 4 |
| 2024 | 5 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device and method of fabricating the same
US-12581989-B2 · Mar 17, 2026 · US
Semiconductor device having a wire bonding pad structure connected through vias to lower wiring
US-2024413107-A1 · Dec 12, 2024 · US
Methods of forming semiconductor packages having a die with an encapsulant
US-2024297131-A1 · Sep 5, 2024 · US
Semiconductor device having a wire bonding pad structure connected through vias to lower wiring
US-12068268-B2 · Aug 20, 2024 · US
Integrated fan-out package structures with recesses in molding compound
US-12057432-B2 · Aug 6, 2024 · US
Semiconductor packages having a die, an encapsulant, and a redistribution structure
US-12021047-B2 · Jun 25, 2024 · US
Semiconductor device and method of fabricating the same
US-2023326893-A1 · Oct 12, 2023 · US
Semiconductor device
US-2023197650-A1 · Jun 22, 2023 · US
Semiconductor device having conductive film
US-11594502-B2 · Feb 28, 2023 · US
Method for preparing a semiconductor device with spacer over sidewall of bonding pad
US-11552032-B2 · Jan 10, 2023 · US
Semiconductor component and manufacturing method thereof
US-11424204-B2 · Aug 23, 2022 · US
Methods of Forming Semiconductor Packages Having a Die with an Encapsulant
US-2022246559-A1 · Aug 4, 2022 · US
Semiconductor package
US-11380636-B2 · Jul 5, 2022 · US
Methods of forming semiconductor packages having a die with an encapsulant
US-11315891-B2 · Apr 26, 2022 · US
Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
US-11251160-B2 · Feb 15, 2022 · US
Semiconductor device having a semiconductor die embedded in a molding compound
US-2021217633-A1 · Jul 15, 2021 · US
Method for preparing a semiconductor device with spacer over sidewall of bonding pad
US-2021202416-A1 · Jul 1, 2021 · US
Semiconductor device with spacer over sidewall of bonding pad and method for preparing the same
US-11024592-B2 · Jun 1, 2021 · US
Temporary post-assisted embedding of semiconductor dies
US-11004700-B2 · May 11, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L2224/02205?
- CPC H01L2224/02205 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L2224/02205 (Electricity)?
- Our database includes 60 publications tagged with this CPC code.
- Is patent activity under CPC H01L2224/02205 growing?
- Publication counts under this code: 4 in 2023 vs 5 in 2024 (latest complete years).