Selective removal of an etching stop layer for improving overlay shift tolerance
US-10867805-B2 · Dec 15, 2020 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01L21/02148 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 109 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 11 |
| 2016 | 9 |
| 2017 | 13 |
| 2018 | 14 |
| 2019 | 9 |
| 2020 | 11 |
| 2021 | 13 |
| 2022 | 8 |
| 2023 | 6 |
| 2024 | 7 |
| 2025 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor Fin cutting process and structures formed thereby
US-10777466-B2 · Sep 15, 2020 · US
Semiconductor device having a memory and manufacturing method thereof
US-2020251599-A1 · Aug 6, 2020 · US
Semiconductor device having a memory and manufacturing method thereof
US-10672916-B2 · Jun 2, 2020 · US
Method for manufacturing semiconductor device
US-2019393317-A1 · Dec 26, 2019 · US
Interface engineering for high capacitance capacitor for liquid crystal display
US-10381454-B2 · Aug 13, 2019 · US
Method of wafer recycling
US-10373818-B1 · Aug 6, 2019 · US
Method of wafer recycling
US-2019237321-A1 · Aug 1, 2019 · US
High-k gate insulator for a thin-film transistor
US-2019206691-A1 · Jul 4, 2019 · US
Semiconductor structure cutting process and structures formed thereby
US-2019164844-A1 · May 30, 2019 · US
Semiconductor device and manufacturing method thereof
US-2019148562-A1 · May 16, 2019 · US
Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-10217629-B2 · Feb 26, 2019 · US
Implantations for Forming Source/Drain Regions of Different Transistors
US-2019035694-A1 · Jan 31, 2019 · US
Doped ferroelectric hafnium oxide film devices
US-10153155-B2 · Dec 11, 2018 · US
Plasma enhanced deposition processes for controlled formation of metal oxide thin films
US-2018350587-A1 · Dec 6, 2018 · US
Ferroelectric-modulated Schottky non-volatile memory
US-10102898-B2 · Oct 16, 2018 · US
Formulation for Deposition of Silicon Doped Hafnium Oxide as Ferroelectric Materials
US-2018269057-A1 · Sep 20, 2018 · US
Ferroelectric-modulated schottky non-volatile memory
US-2018190338-A1 · Jul 5, 2018 · US
Method of forming dielectric films, new precursors and their use in semiconductor manufacturing
US-2018151354-A1 · May 31, 2018 · US
Semiconductor structures and fabrication method thereof
US-9984882-B2 · May 29, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01L21/02148?
- CPC H01L21/02148 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H01L21/02148 (Electricity)?
- Our database includes 109 publications tagged with this CPC code.
- Is patent activity under CPC H01L21/02148 growing?
- Publication counts under this code: 7 in 2024 vs 8 in 2025 (latest complete years).