Method for producing an integrated circuit pointed element comprising etching first and second etchable materials with a particular etchant to form an open crater in a project
US-11536872-B2 · Dec 27, 2022 · US
Thermally-sensitive members · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01H37/32 |
| Official title | Thermally-sensitive members |
| Display label | Thermally-sensitive members |
| Total patents | 73 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 9 |
| 2017 | 11 |
| 2018 | 6 |
| 2019 | 8 |
| 2020 | 6 |
| 2021 | 7 |
| 2022 | 6 |
| 2023 | 4 |
| 2025 | 5 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11536872-B2 · Dec 27, 2022 · US
US-11469065-B2 · Oct 11, 2022 · US
US-11222762-B2 · Jan 11, 2022 · US
US-11152179-B2 · Oct 19, 2021 · US
US-11145944-B2 · Oct 12, 2021 · US
US-11094487-B2 · Aug 17, 2021 · US
US-2021249581-A1 · Aug 12, 2021 · US
US-2021234318-A1 · Jul 29, 2021 · US
US-2021166899-A1 · Jun 3, 2021 · US
US-10902762-B2 · Jan 26, 2021 · US
US-2020373109-A1 · Nov 26, 2020 · US
US-2020309420-A1 · Oct 1, 2020 · US
US-10763482-B2 · Sep 1, 2020 · US
US-2020072564-A1 · Mar 5, 2020 · US
US-2020059084-A1 · Feb 20, 2020 · US
US-2020013319-A1 · Jan 9, 2020 · US
US-2019393477-A1 · Dec 26, 2019 · US
US-10505106-B1 · Dec 10, 2019 · US
US-2019310389-A1 · Oct 10, 2019 · US
US-10379254-B2 · Aug 13, 2019 · US
Answers are generated from the same data shown on this page.