Dissimilar metal joined material and method of manufacturing same
US-2019337086-A1 · Nov 7, 2019 · US
Materials for bimetals · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01H2037/526 |
| Official title | {Materials for bimetals} |
| Display label | Materials for bimetals |
| Total patents | 4 |
Year-over-year patent counts classified under this CPC code.
Filing activity appears to be growing based on the most recent years.
| Year | Patents |
|---|---|
| 2016 | 1 |
| 2019 | 3 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2019337086-A1 · Nov 7, 2019 · US
US-10283300-B2 · May 7, 2019 · US
US-2019096618-A1 · Mar 28, 2019 · US
US-9455109-B2 · Sep 27, 2016 · US