Circuit board assembly and manufacturing method thereof
US-12324100-B2 · Jun 3, 2025 · US
Details of manufacturing of the bimetals, e.g. connection to non bimetallic elements or insulating coatings · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01H2037/525 |
| Official title | {Details of manufacturing of the bimetals, e.g. connection to non bimetallic elements or insulating coatings} |
| Display label | Details of manufacturing of the bimetals, e.g. connection to non bimetallic elements or insulating coatings |
| Total patents | 7 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 1 |
| 2019 | 1 |
| 2020 | 1 |
| 2024 | 1 |
| 2025 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12324100-B2 · Jun 3, 2025 · US
US-2024064901-A1 · Feb 22, 2024 · US
US-10529514-B2 · Jan 7, 2020 · US
US-2019337086-A1 · Nov 7, 2019 · US
US-9779900-B2 · Oct 3, 2017 · US
US-9455109-B2 · Sep 27, 2016 · US
US-2015145636-A1 · May 28, 2015 · US