Device for modifying a linear substrate
US-12485448-B2 · Dec 2, 2025 · US
Material preparing or feeding devices · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01B13/326 |
| Official title | {Material preparing or feeding devices} |
| Display label | Material preparing or feeding devices |
| Total patents | 17 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2017 | 1 |
| 2019 | 5 |
| 2021 | 2 |
| 2022 | 4 |
| 2024 | 2 |
| 2025 | 3 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12485448-B2 · Dec 2, 2025 · US
US-2025322979-A1 · Oct 16, 2025 · US
US-2025256297-A1 · Aug 14, 2025 · US
US-12103035-B2 · Oct 1, 2024 · US
US-12097527-B2 · Sep 24, 2024 · US
US-2022305517-A1 · Sep 29, 2022 · US
US-2022134377-A1 · May 5, 2022 · US
US-2022134376-A1 · May 5, 2022 · US
US-11298719-B2 · Apr 12, 2022 · US
US-2021260618-A1 · Aug 26, 2021 · US
US-11033923-B2 · Jun 15, 2021 · US
US-2019193102-A1 · Jun 27, 2019 · US
US-10319499-B1 · Jun 11, 2019 · US
US-2019164662-A1 · May 30, 2019 · US
US-2019164663-A1 · May 30, 2019 · US
US-2019070629-A1 · Mar 7, 2019 · US
US-9718080-B1 · Aug 1, 2017 · US