Methods and materials for metallic photoresist
US-2024288767-A1 · Aug 29, 2024 · US
involving an interaction between the metallic and non-metallic component, e.g. photodope systems
involving an interaction between the metallic and non-metallic component, e.g. photodope systems · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G03F7/0044 |
| Official title | {involving an interaction between the metallic and non-metallic component, e.g. photodope systems} |
| Display label | involving an interaction between the metallic and non-metallic component, e.g. photodope systems |
| Total patents | 83 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2017 | 4 |
| 2018 | 7 |
| 2019 | 8 |
| 2020 | 8 |
| 2021 | 8 |
| 2022 | 8 |
| 2023 | 11 |
| 2024 | 13 |
| 2025 | 15 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Photoresist and formation method thereof
US-2024242966-A1 · Jul 18, 2024 · US
Semiconductor photoresist composition and method of forming patters using the composition
US-2024168375-A1 · May 23, 2024 · US
Sample support
US-11947260-B2 · Apr 2, 2024 · US
Zinc-based metal organic nanoparticle, preparation method therefor, and photoresist
US-2024077801-A1 · Mar 7, 2024 · US
Photoresist composition and method of forming photoresist pattern
US-2023384670-A1 · Nov 30, 2023 · US
Secondary electron generating composition
US-2023266665-A1 · Aug 24, 2023 · US
Lithographic printing plate precursor and method of use
US-11714354-B2 · Aug 1, 2023 · US
Blank mask and photomask using the same
US-2023213849-A1 · Jul 6, 2023 · US
Solution, solution storage body, actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and manufacturing method of semiconductor device
US-2023135117-A1 · May 4, 2023 · US
Sample support
US-2023131548-A1 · Apr 27, 2023 · US
Resist composition and method for forming resist pattern
US-2023107966-A1 · Apr 6, 2023 · US
Quantum dot-polymer composite film, method of manufacturing the same, and device including the same
US-11613694-B2 · Mar 28, 2023 · US
Method of manufacturing semiconductor device
US-2023076633-A1 · Mar 9, 2023 · US
Solution, solution storage body, actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and manufacturing method of semiconductor device
US-11573489-B2 · Feb 7, 2023 · US
Method for a photon induced material deposition and a device therefor
US-11554541-B2 · Jan 17, 2023 · US
Metalorganic films for extreme ultraviolet patterning
US-2022382159-A1 · Dec 1, 2022 · US
Method of manufacturing a semiconductor device
US-2022351964-A1 · Nov 3, 2022 · US
Secondary electron generating composition
US-11487199-B2 · Nov 1, 2022 · US
Photocurable composition and pattern forming method
US-2022334475-A1 · Oct 20, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC G03F7/0044?
- CPC G03F7/0044 is the Cooperative Patent Classification code for “involving an interaction between the metallic and non-metallic component, e.g. photodope systems.”
- How many patents are filed under CPC G03F7/0044 (involving an interaction between the metallic and non-metallic component, e.g. photodope systems)?
- Our database includes 83 publications tagged with this CPC code.
- Is patent activity under CPC G03F7/0044 growing?
- Publication counts under this code: 13 in 2024 vs 15 in 2025 (latest complete years).