Methods of forming structures, semiconductor processing systems, and semiconductor device structures
US-2024209510-A1 · Jun 27, 2024 · US
Arrangements for compensating for auxiliary variables, e.g. length of lead · Cooperative Patent Classification (CPC)
Computing, optics, measurement, and control technologies.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | G01K7/10 |
| Official title | Arrangements for compensating for auxiliary variables, e.g. length of lead |
| Display label | Arrangements for compensating for auxiliary variables, e.g. length of lead |
| Total patents | 27 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2018 | 4 |
| 2019 | 4 |
| 2020 | 3 |
| 2021 | 4 |
| 2022 | 4 |
| 2023 | 2 |
| 2024 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2024209510-A1 · Jun 27, 2024 · US
US-11959173-B2 · Apr 16, 2024 · US
US-11815407-B2 · Nov 14, 2023 · US
US-2023258507-A1 · Aug 17, 2023 · US
US-2022298643-A1 · Sep 22, 2022 · US
US-11307101-B2 · Apr 19, 2022 · US
US-2022042855-A1 · Feb 10, 2022 · US
US-11226242-B2 · Jan 18, 2022 · US
US-11193835-B2 · Dec 7, 2021 · US
US-11143560-B2 · Oct 12, 2021 · US
US-11054315-B2 · Jul 6, 2021 · US
US-2021063247-A1 · Mar 4, 2021 · US
US-2020378839-A1 · Dec 3, 2020 · US
US-10647440-B2 · May 12, 2020 · US
US-2020049571-A1 · Feb 13, 2020 · US
US-2019293497-A1 · Sep 26, 2019 · US
US-2019285485-A1 · Sep 19, 2019 · US
US-2019212207-A1 · Jul 11, 2019 · US
US-2019145836-A1 · May 16, 2019 · US
US-2018238741-A1 · Aug 23, 2018 · US
Answers are generated from the same data shown on this page.