Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry
US-12054651-B2 · Aug 6, 2024 · US
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Polyphenylenes
Polyphenylenes · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J165/02 |
| Official title | Polyphenylenes |
| Display label | Polyphenylenes |
| Total patents | 17 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 4 |
| 2017 | 2 |
| 2018 | 2 |
| 2019 | 1 |
| 2021 | 2 |
| 2023 | 1 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry
US-2023227702-A1 · Jul 20, 2023 · US
Adhesive composition, thermosetting adhesive sheet, and printed wiring board
US-2021040360-A1 · Feb 11, 2021 · US
Methods for enhancing the bonding strength of thermoset adhesives and sealants via disulfide dynamic chemistry
US-2021009872-A1 · Jan 14, 2021 · US
Polyarylether ketone imide sulfone adhesives
US-10501665-B2 · Dec 10, 2019 · US
Polyarylether ketone imide sulfone adhesives
US-2018334598-A1 · Nov 22, 2018 · US
Polyarylether ketone imide sulfone adhesives
US-9976063-B2 · May 22, 2018 · US
Polyarylether ketone imide sulfone adhesives
US-2017260432-A1 · Sep 14, 2017 · US
Low surface energy adhesive
US-9574117-B2 · Feb 21, 2017 · US
Under-fill material and method for producing semiconductor device
US-9368421-B2 · Jun 14, 2016 · US
Low surface energy adhesive
US-2016108295-A1 · Apr 21, 2016 · US
Soft magnetic thermosetting adhesive film, magnetic film laminate circuit board, and position detection device
US-2016083626-A1 · Mar 24, 2016 · US
Tire
US-2016075182-A1 · Mar 17, 2016 · US
Under-Fill Material and Method for Producing Semiconductor Device
US-2015270188-A1 · Sep 24, 2015 · US
Under-fill material and method for producing semiconductor device
US-9085685-B2 · Jul 21, 2015 · US
Adhesive, and transparent substrate using same
US-2015140343-A1 · May 21, 2015 · US
Side-chain and end-group modified poly-p-phenylene oligomers
US-9023954-B1 · May 5, 2015 · US