Monomer mixture, resin composition, resin molded article, panel for aquariums, illuminated sign, building component, method for producing resin composition, and method for manufacturing resin cast board
US-12583951-B2 · Mar 24, 2026 · US
Phosphinous compounds, e.g. R2=P—OR'
Phosphinous compounds, e.g. R2=P—OR' · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08K5/5377 |
| Official title | Phosphinous compounds, e.g. R2=P—OR' |
| Display label | Phosphinous compounds, e.g. R2=P—OR' |
| Total patents | 29 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2016 | 2 |
| 2017 | 1 |
| 2018 | 3 |
| 2019 | 3 |
| 2020 | 1 |
| 2021 | 3 |
| 2022 | 1 |
| 2023 | 6 |
| 2024 | 5 |
| 2025 | 2 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Heterophasic polypropylene composition
US-12577383-B2 · Mar 17, 2026 · US
Endoscopic flexible tube, endoscopic medical apparatus, and endoscopic-flexible-tube-base-covering material
US-12390248-B2 · Aug 19, 2025 · US
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
US-12234318-B2 · Feb 25, 2025 · US
Nanoparticle composition, nanoparticle-containing film, light-emitting element, wavelength conversion member, display device, and method for producing nanoparticle-containing film
US-2024425656-A1 · Dec 26, 2024 · US
Polycarbonate compositions
US-2024294750-A1 · Sep 5, 2024 · US
Polymers for use in electronic devices
US-2024279399-A1 · Aug 22, 2024 · US
Thermoplastic resin composition and molded product using same
US-11987666-B2 · May 21, 2024 · US
Monomer mixture, resin composition, resin molded article, panel for aquariums, illuminated sign, building component, method for producing resin composition, and method for manufacturing resin cast board
US-2024043582-A1 · Feb 8, 2024 · US
Polyamide filaments for use in 3d printing
US-2023357569-A1 · Nov 9, 2023 · US
Resin composition, resin molded article, and method for producing resin molded article
US-2023287206-A1 · Sep 14, 2023 · US
Epoxy composition
US-11732085-B2 · Aug 22, 2023 · US
Endoscopic flexible tube, endoscopic medical apparatus, and endoscopic-flexible-tube-base-covering material
US-2023157720-A1 · May 25, 2023 · US
Heterophasic polypropylene composition
US-2023094231-A1 · Mar 30, 2023 · US
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
US-2023045615-A1 · Feb 9, 2023 · US
Epoxy composition
US-2022017685-A1 · Jan 20, 2022 · US
Thermoplastic Resin Composition and Molded Product Using Same
US-2021261727-A1 · Aug 26, 2021 · US
One-pack addition curable silicone composition, method for storing same, and method for curing same
US-11041072-B2 · Jun 22, 2021 · US
Flame retardant mixtures, the production and the use thereof
US-11028324-B2 · Jun 8, 2021 · US
Polycarbonate compositions
US-2020385570-A1 · Dec 10, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08K5/5377?
- CPC C08K5/5377 is the Cooperative Patent Classification code for “Phosphinous compounds, e.g. R2=P—OR'.”
- How many patents are filed under CPC C08K5/5377 (Phosphinous compounds, e.g. R2=P—OR')?
- Our database includes 29 publications tagged with this CPC code.
- Is patent activity under CPC C08K5/5377 growing?
- Publication counts under this code: 5 in 2024 vs 2 in 2025 (latest complete years).