Silver Pastes Used for Manufacturing a Printed Antenna
US-2025115792-A1 · Apr 10, 2025 · US
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having three nitrogen atoms in the ring
having three nitrogen atoms in the ring · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/508 |
| Official title | {having three nitrogen atoms in the ring} |
| Display label | having three nitrogen atoms in the ring |
| Total patents | 22 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2017 | 3 |
| 2018 | 3 |
| 2019 | 4 |
| 2020 | 4 |
| 2021 | 2 |
| 2022 | 3 |
| 2024 | 1 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Fast-cure resin formulations with consistent handling characteristics
US-2025075028-A1 · Mar 6, 2025 · US
Fast-cure resin formulations with consistent handling characteristics
US-12139575-B2 · Nov 12, 2024 · US
Fast-curing epoxy systems
US-11370876-B2 · Jun 28, 2022 · US
Fast-curing epoxy systems
US-11370877-B2 · Jun 28, 2022 · US
Fast-curing epoxy systems
US-11286335-B2 · Mar 29, 2022 · US
Thermosetting resin composition
US-11104760-B2 · Aug 31, 2021 · US
Fast-cure resin formulations with consistent handling characteristics
US-2021047460-A1 · Feb 18, 2021 · US
Fast-curing epoxy systems
US-2020172723-A1 · Jun 4, 2020 · US
Sheet adhesive and adhesion process using the same
US-10633512-B2 · Apr 28, 2020 · US
Thermosetting resin composition
US-2020087445-A1 · Mar 19, 2020 · US
Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods
US-10556985-B2 · Feb 11, 2020 · US
Fast-curing epoxy systems
US-2019352452-A1 · Nov 21, 2019 · US
Fast-curing epoxy systems
US-2019352450-A1 · Nov 21, 2019 · US
Fast-curing epoxy systems
US-2019352449-A1 · Nov 21, 2019 · US
Epoxy curing agents, compositions and uses thereof
US-10465039-B2 · Nov 5, 2019 · US
Film adhesive and semiconductor device including the same
US-10023775-B2 · Jul 17, 2018 · US
Curable resin composition, molded curable-resin object, cured object, layered product, composite, and multilayered printed wiring board
US-2018117891-A1 · May 3, 2018 · US
Film adhesive and semiconductor device including the same
US-2018016479-A1 · Jan 18, 2018 · US
Sheet adhesive and adhesion process using the same
US-2017349789-A1 · Dec 7, 2017 · US