Multi-metallic organometallic complexes, and related polymers, compositions, methods and systems
US-9233996-B2 · Jan 12, 2016 · US
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the metallic compound containing a multidentate ligand, i.e. a ligand capable of donating two or more pairs of electrons to form a coordinate or ionic bond
the metallic compound containing a multidentate ligand, i.e. a ligand capable of donating two or more pairs of electrons to form a coordinate or ionic bond · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F4/60003 |
| Official title | {the metallic compound containing a multidentate ligand, i.e. a ligand capable of donating two or more pairs of electrons to form a coordinate or ionic bond} |
| Display label | the metallic compound containing a multidentate ligand, i.e. a ligand capable of donating two or more pairs of electrons to form a coordinate or ionic bond |
| Total patents | 1 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2016 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.