Compound, resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package
US-2026071011-A1 · Mar 12, 2026 · US
containing two rings · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C07C15/58 |
| Official title | containing two rings |
| Display label | containing two rings |
| Total patents | 19 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 2 |
| 2017 | 3 |
| 2018 | 2 |
| 2021 | 2 |
| 2023 | 3 |
| 2024 | 1 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2026071011-A1 · Mar 12, 2026 · US
US-11905449-B2 · Feb 20, 2024 · US
US-11833494-B2 · Dec 5, 2023 · US
US-11772083-B2 · Oct 3, 2023 · US
US-2023287262-A1 · Sep 14, 2023 · US
US-2021388269-A1 · Dec 16, 2021 · US
US-10967364-B2 · Apr 6, 2021 · US
US-10059640-B2 · Aug 28, 2018 · US
US-2018170829-A1 · Jun 21, 2018 · US
US-9845317-B2 · Dec 19, 2017 · US
US-9718763-B2 · Aug 1, 2017 · US
US-9581905-B2 · Feb 28, 2017 · US
US-9328102-B2 · May 3, 2016 · US
US-2016085152-A1 · Mar 24, 2016 · US
US-9224959-B2 · Dec 29, 2015 · US
US-9193935-B2 · Nov 24, 2015 · US
US-9123896-B2 · Sep 1, 2015 · US
US-9006463-B2 · Apr 14, 2015 · US
US-8951831-B2 · Feb 10, 2015 · US