Compound, resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package
US-2026071011-A1 · Mar 12, 2026 · US
Indenes; Completely or partially hydrogenated indenes · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C07C13/465 |
| Official title | Indenes; Completely or partially hydrogenated indenes |
| Display label | Indenes; Completely or partially hydrogenated indenes |
| Total patents | 42 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 5 |
| 2017 | 10 |
| 2018 | 3 |
| 2019 | 7 |
| 2020 | 2 |
| 2021 | 4 |
| 2022 | 4 |
| 2023 | 1 |
| 2024 | 1 |
| 2025 | 1 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2026071011-A1 · Mar 12, 2026 · US
US-12331013-B2 · Jun 17, 2025 · US
US-2024051899-A1 · Feb 15, 2024 · US
US-11753360-B2 · Sep 12, 2023 · US
US-11456421-B2 · Sep 27, 2022 · US
US-11377405-B2 · Jul 5, 2022 · US
US-11370733-B2 · Jun 28, 2022 · US
US-11352376-B2 · Jun 7, 2022 · US
US-2021395172-A1 · Dec 23, 2021 · US
US-11174329-B2 · Nov 16, 2021 · US
US-11063221-B2 · Jul 13, 2021 · US
US-11021421-B2 · Jun 1, 2021 · US
US-2020048171-A1 · Feb 13, 2020 · US
US-2020006664-A1 · Jan 2, 2020 · US
US-10461257-B2 · Oct 29, 2019 · US
US-10450390-B2 · Oct 22, 2019 · US
US-10435345-B2 · Oct 8, 2019 · US
US-10363551-B2 · Jul 30, 2019 · US
US-2019225719-A1 · Jul 25, 2019 · US
US-10227433-B2 · Mar 12, 2019 · US
Answers are generated from the same data shown on this page.