Ceramic matrix composite component repairing and joining
US-12577174-B2 · Mar 17, 2026 · US
Ceramic interlayers
Ceramic interlayers · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/04 |
| Official title | Ceramic interlayers |
| Display label | Ceramic interlayers |
| Total patents | 35 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 8 |
| 2017 | 4 |
| 2018 | 3 |
| 2019 | 3 |
| 2020 | 2 |
| 2021 | 2 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 4 |
| 2025 | 3 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Composite components and methods for preventing flow from infiltrated component during re-infiltration
US-2025340492-A1 · Nov 6, 2025 · US
Composite components and methods for preventing flow from infiltrated component during re-infiltration
US-12384727-B2 · Aug 12, 2025 · US
Ceramic matrix composite component repairing and joining
US-2025243125-A1 · Jul 31, 2025 · US
Ceramic structural body
US-12145891-B2 · Nov 19, 2024 · US
Unitary ceramic components and methods of forming the same
US-2024279125-A1 · Aug 22, 2024 · US
Methods for joining ceramic components to form unitary ceramic components
US-11884597-B2 · Jan 30, 2024 · US
High temperature interfaces for ceramic composites
US-11866377-B2 · Jan 9, 2024 · US
Methods for joining ceramic components to form unitary ceramic components
US-2023416163-A1 · Dec 28, 2023 · US
Composite components and methods for preventing flow from infiltrated component during re-infiltration
US-2023416162-A1 · Dec 28, 2023 · US
High temperature interfaces for ceramic composites
US-2022348509-A1 · Nov 3, 2022 · US
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method
US-11396059-B2 · Jul 26, 2022 · US
Ceramic structural body
US-2021292247-A1 · Sep 23, 2021 · US
Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method
US-2021178509-A1 · Jun 17, 2021 · US
Packaging film for battery and manufacturing method thereof
US-10720613-B2 · Jul 21, 2020 · US
Apparatus and method of manufacturing ceramic honeycomb body
US-10596721-B2 · Mar 24, 2020 · US
Turbine engine components with chemical vapor infiltrated isolation layers
US-10294802-B2 · May 21, 2019 · US
Manufacturing method of honeycomb structure, and bonding material
US-10279573-B2 · May 7, 2019 · US
Apparatus and method of manufacturing ceramic honeycomb body
US-2019099916-A1 · Apr 4, 2019 · US
Packaging film for battery and manufacturing method thereof
US-2018301670-A1 · Oct 18, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/04?
- CPC C04B2237/04 is the Cooperative Patent Classification code for “Ceramic interlayers.”
- How many patents are filed under CPC C04B2237/04 (Ceramic interlayers)?
- Our database includes 35 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/04 growing?
- Publication counts under this code: 4 in 2024 vs 3 in 2025 (latest complete years).