Electrically conductive bonding tape with low passive intermodulation
US-12584043-B2 · Mar 24, 2026 · US
Copper or nickel
Copper or nickel · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B32B2264/1055 |
| Official title | Copper or nickel |
| Display label | Copper or nickel |
| Total patents | 47 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2018 | 1 |
| 2020 | 1 |
| 2021 | 11 |
| 2022 | 7 |
| 2023 | 12 |
| 2024 | 10 |
| 2025 | 2 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Decorative panel, and decorative floor covering consisting of said panels
US-12577790-B2 · Mar 17, 2026 · US
Electrically conductive bonding tape with low passive intermodulation
US-12552971-B2 · Feb 17, 2026 · US
Resin coated copper and circuit board including the same
US-12376229-B2 · Jul 29, 2025 · US
Heatable laminated side glazing
US-12233626-B2 · Feb 25, 2025 · US
Buffer structure and preparation method for same, and display apparatus
US-2024391209-A1 · Nov 28, 2024 · US
Mattress assembly with reduced heat index
US-2024365991-A1 · Nov 7, 2024 · US
Electrically conductive bonding tape with low passive intermodulation
US-12129411-B2 · Oct 29, 2024 · US
Bonding paste, bonding layer, bonded body, and method for producing bonded body
US-2024321806-A1 · Sep 26, 2024 · US
Electrically conductive bonding tape with low passive intermodulation
US-2024309247-A1 · Sep 19, 2024 · US
Bonding sheet with preform layer, method for manufacturing bonded body, and to-be-bonded member with preform layer
US-2024300215-A1 · Sep 12, 2024 · US
Sheet assembly for forming one or more cards
US-2024300231-A1 · Sep 12, 2024 · US
Conductive composition for bonding, bonding structure using same, and manufacturing method thereof
US-2024116104-A1 · Apr 11, 2024 · US
Laminate
US-11948907-B2 · Apr 2, 2024 · US
Decorative Panel, and Decorative Floor Covering Consisting of Said Panels
US-2024052643-A1 · Feb 15, 2024 · US
Brake pad for a disk brake system and disk brake system
US-2023375055-A1 · Nov 23, 2023 · US
Base material for printed circuit board and printed circuit board
US-11752734-B2 · Sep 12, 2023 · US
Lightning strike protection surfacer and method of manufacturing the same
US-11712860-B2 · Aug 1, 2023 · US
Resin coated copper and circuit board including the same
US-2023240008-A1 · Jul 27, 2023 · US
Electrically conductive bonding tape with low passive intermodulation
US-2023235200-A1 · Jul 27, 2023 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B32B2264/1055?
- CPC B32B2264/1055 is the Cooperative Patent Classification code for “Copper or nickel.”
- How many patents are filed under CPC B32B2264/1055 (Copper or nickel)?
- Our database includes 47 publications tagged with this CPC code.
- Is patent activity under CPC B32B2264/1055 growing?
- Publication counts under this code: 10 in 2024 vs 2 in 2025 (latest complete years).