Splitter profiler
US-11628586-B2 · Apr 18, 2023 · US
for sawing with the saw blade abutting parallel against a surface of the workpiece · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B27B5/08 |
| Official title | for sawing with the saw blade abutting parallel against a surface of the workpiece |
| Display label | for sawing with the saw blade abutting parallel against a surface of the workpiece |
| Total patents | 5 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2018 | 1 |
| 2019 | 1 |
| 2020 | 1 |
| 2022 | 1 |
| 2023 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-11628586-B2 · Apr 18, 2023 · US
US-11420356-B2 · Aug 23, 2022 · US
US-2020023540-A1 · Jan 23, 2020 · US
US-2019351573-A1 · Nov 21, 2019 · US
US-9862120-B2 · Jan 9, 2018 · US