Electrode plate notching device
US-2025385291-A1 · Dec 18, 2025 · US
having die balancing or compensating means · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B26F2001/4409 |
| Official title | {having die balancing or compensating means} |
| Display label | having die balancing or compensating means |
| Total patents | 14 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2019 | 3 |
| 2020 | 3 |
| 2022 | 3 |
| 2023 | 1 |
| 2024 | 3 |
| 2025 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2025385291-A1 · Dec 18, 2025 · US
US-12122062-B2 · Oct 22, 2024 · US
US-12053901-B2 · Aug 6, 2024 · US
US-2024165843-A1 · May 23, 2024 · US
US-2023056645-A1 · Feb 23, 2023 · US
US-2022297337-A1 · Sep 22, 2022 · US
US-11389986-B2 · Jul 19, 2022 · US
US-11338534-B2 · May 24, 2022 · US
US-10850422-B2 · Dec 1, 2020 · US
US-10751901-B2 · Aug 25, 2020 · US
US-2020180182-A1 · Jun 11, 2020 · US
US-2019176358-A1 · Jun 13, 2019 · US
US-2019152087-A1 · May 23, 2019 · US
US-2019152182-A1 · May 23, 2019 · US