Systems and methods for kerfing veneers
US-2015375343-A1 · Dec 31, 2015 · US
Operations & Transport
Operations & Transport · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/367 |
| Official title | — |
| Display label | Operations & Transport (mapped technology topic) |
| Total patents | 91 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 66 |
| 2016 | 20 |
| 2017 | 3 |
| 2018 | 1 |
| 2019 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Wafer dicing from wafer backside and front side
US-9224650-B2 · Dec 29, 2015 · US
Laser and plasma etch wafer dicing using water-soluble die attach film
US-9224625-B2 · Dec 29, 2015 · US
Ultrashort laser pulse wafer scribing
US-9221124-B2 · Dec 29, 2015 · US
Laser processing apparatus and container manufacturing apparatus
US-9221123-B2 · Dec 29, 2015 · US
Golf club head and manufacturing method for the same
US-2015367199-A1 · Dec 24, 2015 · US
Compound slot
US-2015367639-A1 · Dec 24, 2015 · US
Hybrid laser and plasma etch wafer dicing using substrate carrier
US-9218992-B2 · Dec 22, 2015 · US
Components with cooling channels and methods of manufacture
US-9216491-B2 · Dec 22, 2015 · US
Conditioning of grooving in polishing pads
US-2015336236-A1 · Nov 26, 2015 · US
Laser processing method and laser processing apparatus
US-9193008-B2 · Nov 24, 2015 · US
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
US-9196536-B1 · Nov 24, 2015 · US
Laser processing apparatus
US-9186750-B2 · Nov 17, 2015 · US
Laser processing apparatus
US-9186749-B2 · Nov 17, 2015 · US
Display mother panel and method of cutting the same
US-2015327361-A1 · Nov 12, 2015 · US
Method and apparatus for laser dicing of wafers
US-2015318210-A1 · Nov 5, 2015 · US
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
US-9177861-B1 · Nov 3, 2015 · US
Device for manufacturing breathable film by using laser and method for manufacturing same
US-2015306704-A1 · Oct 29, 2015 · US
Hybrid wafer dicing approach using collimated laser scribing process and plasma etch
US-2015287638-A1 · Oct 8, 2015 · US
Laser processing apparatus
US-2015283650-A1 · Oct 8, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/367?
- CPC B23K26/367 is the Cooperative Patent Classification code for “Operations & Transport.”
- How many patents are filed under CPC B23K26/367 (Operations & Transport)?
- Our database includes 91 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/367 growing?
- Publication counts under this code: 1 in 2018 vs 1 in 2019 (latest complete years).