Wavelength conversion member for soldering, wavelength conversion device, and light source device
US-2022347781-A1 · Nov 3, 2022 · US
Soldering by means of radiant energy
Soldering by means of radiant energy · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K1/005 |
| Official title | Soldering by means of radiant energy |
| Display label | Soldering by means of radiant energy |
| Total patents | 88 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 8 |
| 2017 | 11 |
| 2018 | 8 |
| 2019 | 8 |
| 2020 | 6 |
| 2021 | 9 |
| 2022 | 9 |
| 2023 | 9 |
| 2024 | 8 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and system for bonding a chip to a substrate
US-11476228-B2 · Oct 18, 2022 · US
Joining apparatus and method for loading a joining element
US-11453080-B2 · Sep 27, 2022 · US
Joining method
US-11213915-B2 · Jan 4, 2022 · US
Radiative heat collective bonder and gangbonder
US-2021407958-A1 · Dec 30, 2021 · US
Space-Based Circuit-Replacing Robotic System
US-2021403179-A1 · Dec 30, 2021 · US
Base body with soldered-on ground pin, method for its production and uses thereof
US-11205610-B2 · Dec 21, 2021 · US
Solder printing inspection device, solder printing inspection method and method of manufacturing substrate
US-11184984-B2 · Nov 23, 2021 · US
Build material formation
US-2021197263-A1 · Jul 1, 2021 · US
Semiconductor device and method for producing semiconductor device
US-2021193611-A1 · Jun 24, 2021 · US
Joining device and joining method
US-2021094119-A1 · Apr 1, 2021 · US
Bonding structure of dissimilar metal members and precursor thereof
US-2021046568-A1 · Feb 18, 2021 · US
Laser-based joining of components
US-10894300-B2 · Jan 19, 2021 · US
Vehicle body structure
US-2020377155-A1 · Dec 3, 2020 · US
Method for manufacturing a structural and/or acoustic panel for a nacelle of an aircraft propulsion unit, and corresponding device
US-2020316701-A1 · Oct 8, 2020 · US
Methods and systems for aligning a component
US-2020288581-A1 · Sep 10, 2020 · US
Lead bonding structure
US-10643915-B2 · May 5, 2020 · US
Laser soldering method and device
US-2020094336-A1 · Mar 26, 2020 · US
System and method of multi-beam soldering
US-2020055132-A1 · Feb 20, 2020 · US
Solder printing inspection device, solder printing inspection method and method of manufacturing substrate
US-2019357361-A1 · Nov 21, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K1/005?
- CPC B23K1/005 is the Cooperative Patent Classification code for “Soldering by means of radiant energy.”
- How many patents are filed under CPC B23K1/005 (Soldering by means of radiant energy)?
- Our database includes 88 publications tagged with this CPC code.
- Is patent activity under CPC B23K1/005 growing?
- Publication counts under this code: 8 in 2024 vs 6 in 2025 (latest complete years).