Tip-loaded microneedle arrays for transdermal insertion
US-2023311426-A1 · Oct 5, 2023 · US
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for shaping dies
for shaping dies · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23C3/20 |
| Official title | for shaping dies |
| Display label | for shaping dies |
| Total patents | 9 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity appears to be growing based on the most recent years.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2018 | 3 |
| 2020 | 1 |
| 2023 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Mold machining method using end mill
US-11697164-B2 · Jul 11, 2023 · US
Method of Manufacturing Shim for Die Coater Using Milling Process
US-2023120286-A1 · Apr 20, 2023 · US
Mold machining method using end mill
US-2020171586-A1 · Jun 4, 2020 · US
Tip-loaded microneedle arrays for transdermal insertion
US-2018272621-A1 · Sep 27, 2018 · US
Method for creating machining data for use in hybrid ultraprecision machining device, and hybrid ultraprecision machining device
US-10052726-B2 · Aug 21, 2018 · US
Tip-loaded microneedle arrays for transdermal insertion
US-9944019-B2 · Apr 17, 2018 · US
Tip-loaded microneedle arrays for transdermal insertion
US-2015126923-A1 · May 7, 2015 · US
Method for creating machining data for use in hybrid ultraprecision machining device, and hybrid ultraprecision machining device
US-2015025667-A1 · Jan 22, 2015 · US