Die forging; Trimming by making use of special dies {; Punching during forging}

Die forging; Trimming by making use of special dies {; Punching during forging} · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB21J5/02
Official titleDie forging; Trimming by making use of special dies {; Punching during forging}
Display labelDie forging; Trimming by making use of special dies {; Punching during forging}
Total patents211

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
201518
201617
201729
201822
201935
202022
202115
202219
202314
202410
20257
20263

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B21J5/02?
CPC B21J5/02 is the Cooperative Patent Classification code for “Die forging; Trimming by making use of special dies {; Punching during forging}.”
How many patents are filed under CPC B21J5/02 (Die forging; Trimming by making use of special dies {; Punching during forging})?
Our database includes 211 publications tagged with this CPC code.
Is patent activity under CPC B21J5/02 growing?
Publication counts under this code: 10 in 2024 vs 7 in 2025 (latest complete years).