Method of fabricating a semiconductor device used in a stacked-type semiconductor device
US-9368424-B2 · Jun 14, 2016 · US
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Tanaka Junji patents
Tanaka Junji holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Apr 21, 2015 |
| Latest publication | Jun 14, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same
US-9153541-B2 · Oct 6, 2015 · US
Starting device
US-9027724-B2 · May 12, 2015 · US
Starting apparatus
US-9010508-B2 · Apr 21, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of fabricating a semiconductor device used in a stacked-type semiconductor device
US-9368424-B2 · Jun 14, 2016 · US
Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same
US-9153541-B2 · Oct 6, 2015 · US
Starting device
US-9027724-B2 · May 12, 2015 · US
Starting apparatus
US-9010508-B2 · Apr 21, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| F16H45/02 | 2 |
| H10W90/754 | 2 |
| H10W90/722 | 2 |
| H10W74/00 | 2 |
| H10W70/60 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Mechanical Engineering | 2 |
| Electricity | 2 |