Structure
US-2023182644-A1 · Jun 15, 2023 · US
Hayashi Telempu Corp was listed as an assignee on 3 patent publications in 2023.
| Metric | Value |
|---|---|
| Company | Hayashi Telempu Corp |
| Year | 2023 |
| Patents | 3 |
Representative publications for Hayashi Telempu Corp in 2023.
US-2023182644-A1 · Jun 15, 2023 · US
US-11661013-B2 · May 30, 2023 · US
US-11577487-B2 · Feb 14, 2023 · US
Most common classification codes for Hayashi Telempu Corp in 2023.
| CPC | Patents |
|---|---|
| A47C31/02 | 1 |
| B29C59/026 | 1 |
| B29K2075/00 | 1 |
| B29K2105/04 | 1 |
| B32B2250/02 | 1 |
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