Member, conductive layer, method for manufacturing member, and method for forming conductive layer
US-2023307407-A1 · Sep 28, 2023 · US
Hasegawa Tohru was listed as an assignee on 1 patent publication in 2023.
| Metric | Value |
|---|---|
| Company | Hasegawa Tohru |
| Year | 2023 |
| Patents | 1 |
Representative publications for Hasegawa Tohru in 2023.
Most common classification codes for Hasegawa Tohru in 2023.
| CPC | Patents |
|---|---|
| C09J163/00 | 1 |
| C09J2463/00 | 1 |
| C09J5/06 | 1 |
| C09J9/02 | 1 |
| H01B5/16 | 1 |
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