Method and apparatus for measuring a free air ball size during wire bonding
US-10163845-B2 · Dec 25, 2018 · US
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Song Keng Yew patents
Song Keng Yew holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Nov 22, 2016 |
| Latest publication | Dec 25, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Wire bonder and method of calibrating a wire bonder
US-9620477-B2 · Apr 11, 2017 · US
Automatic wire tail adjustment system for wire bonders
US-9502374-B2 · Nov 22, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method and apparatus for measuring a free air ball size during wire bonding
US-10163845-B2 · Dec 25, 2018 · US
Wire bonder and method of calibrating a wire bonder
US-9620477-B2 · Apr 11, 2017 · US
Automatic wire tail adjustment system for wire bonders
US-9502374-B2 · Nov 22, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Operations & Transport | 2 |