Wafer-level chip-scale package device having bump assemblies configured to maintain standoff height
US-10804233-B1 · Oct 13, 2020 · US
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Khandekar Viren patents
Khandekar Viren holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Nov 17, 2015 |
| Latest publication | Oct 13, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Three-dimensional chip-to-wafer integration
US-9190391-B2 · Nov 17, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W72/29 | 2 |
| H10W72/0198 | 2 |
| H10W70/66 | 2 |
| H10W90/724 | 2 |
| H10W72/252 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |